Multilayer ceramic electronic component having external electrode layers with holes

ABSTRACT

A multilayer ceramic electronic component includes a ceramic body including dielectric layers and first and second internal electrodes alternately stacked with each of the dielectric layers interposed therebetween. First and second external electrodes are disposed on outer surfaces of the ceramic body, connected to the first and second internal electrodes respectively, and disposed to cover at least five of eight corners of the ceramic body. The first and second external electrodes include, respectively, first and second base electrode layers at least partially in contact with the outer surfaces of the ceramic body and first and second plating layers disposed to cover the first and second base electrode layers, respectively. The first and second plating or base electrode layers have one or more to three or less holes positioned adjacent to one or more to three or less of the eight corners of the ceramic body.

CROSS-REFERENCE TO RELATED APPLICATION(S)

This application is the Continuation of U.S. patent application Ser. No.16/186,008 filed Nov. 9, 2018, which claims benefit of priority toKorean Patent Application No. 10-2018-0105915 filed on Sep. 5, 2018 inthe Korean Intellectual Property Office, the disclosures of which areincorporated herein by reference in its entirety.

BACKGROUND 1. Field

The present disclosure relates to a multilayer ceramic electroniccomponent.

2. Description of Related Art

Multilayer ceramic electronic components are widely used as aninformation technology (IT) components in computers, personal digitalassistants (PDAs), cellular phones, and the like. The multilayer ceramicelectronic components can have a small size while implementing highcapacitance, may be easily mounted, and have been widely used aselectrical components in view of their high reliability and highdurability characteristics.

An external electrode included in a multilayer ceramic electroniccomponent is an electrode exposed externally of the multilayer ceramicelectronic component, and has a significant influence on reliability anddurability of the multilayer ceramic electronic component.

Recently, in accordance with miniaturization and functionalityimprovements of multilayer ceramic electronic components, a thickness ofexternal electrodes has gradually decreased. However, as the thicknessof external electrodes is decreased, reliability and durability of theexternal electrode may also be decreased.

SUMMARY

As a thickness of an external electrode is decreased, a plating layerand/or a base electrode layer included in the external electrode mayhave holes positioned at points corresponding to eight corners of aceramic body.

An aspect of the present disclosure may provide a multilayer ceramicelectronic component in which a thickness of the external electrode maybe decreased and deterioration of water proof reliability and a mountingdefective rate of the external electrode may be substantiallysuppressed, by optimizing the number of holes.

According to an aspect of the present disclosure, a multilayer ceramicelectronic component may include a ceramic body including dielectriclayers and first and second internal electrodes alternately stacked in athickness direction and respectively exposed to one opposing surfaces ofthe ceramic body with each of the dielectric layers interposedtherebetween. First and second external electrodes are disposed on outersurfaces of the ceramic body to be connected to the first and secondinternal electrodes, respectively, and disposed to cover at least fiveof eight corners of the ceramic body. The first and second externalelectrodes include, respectively, first and second base electrode layersat least partially in contact with the outer surfaces of the ceramicbody and first and second plating layers disposed to cover the first andsecond base electrode layers, respectively. The first and second platinglayers have one or more to three or less holes positioned adjacent toone or more to three or less of the eight corners of the ceramic body.

According to another aspect of the present disclosure, a multilayerceramic electronic component may include a ceramic body includingdielectric layers and first and second internal electrodes alternatelystacked in a thickness direction and respectively exposed to opposingend surfaces of the ceramic body with each of the dielectric layersinterposed therebetween. First and second external electrodes aredisposed on outer surfaces of the ceramic body to be connected to thefirst and second internal electrodes, respectively, and disposed tocover at least five of eight corners of the ceramic body. The first andsecond external electrodes include, respectively, first and second baseelectrode layers at least partially in contact with the outer surfacesof the ceramic body and first and second plating layers disposed tocover the first and second base electrode layers, respectively. Thefirst and second base electrode layers have one or more to three or lessholes positioned adjacent to the eight corners of the ceramic body.

According to a further aspect of the present disclosure, a multilayerceramic electronic component may include a ceramic body includingalternately stacked first and second internal electrodes with dielectriclayers therebetween, and first and second external electrodes disposedon respective opposing end surface of the ceramic body through which thefirst and second internal electrodes are respectively exposed, andextending on four side surfaces of the ceramic body adjacent to theopposing end surfaces. The first and second external electrodes aredisposed on at least five of eight corners of the ceramic body. Each ofthe first and second external electrodes includes a base electrode layerin contact with the respective end surface and the four side surfaces ofthe ceramic body, and a plating layer covering the base electrode layer,and at least one of the base electrode layers and the plating layers ofthe first and second external electrodes includes one or more and threeor less holes extending therethrough.

BRIEF DESCRIPTION OF DRAWINGS

The above and other aspects, features, and advantages of the presentdisclosure will be more clearly understood from the following detaileddescription taken in conjunction with the accompanying drawings, inwhich:

FIG. 1 is a perspective view illustrating a multilayer ceramicelectronic component according to an exemplary embodiment;

FIG. 2 is a cross-sectional view taken along line A-A′ of FIG. 1;

FIG. 3 is an enlarged view of region S of FIG. 2;

FIG. 4 is a perspective view illustrating corners of the multilayerceramic electronic component according to an exemplary embodiment;

FIG. 5 is a perspective view illustrating a multilayer ceramicelectronic component according to an exemplary embodiment that ismounted on a board;

FIG. 6A shows images, captured by a scanning electron microscope (SEM),of a multilayer ceramic electronic component that has holes disposed atcorners; and

FIG. 6B shows images, captured by an SEM, of a multilayer ceramicelectronic component that does not have holes disposed at corners.

DETAILED DESCRIPTION

Hereinafter, exemplary embodiments will now be described in detail withreference to the accompanying drawings.

Directions of a hexahedron will be defined in order to clearly describeexemplary embodiments in the present disclosure. L, W and T illustratedin the drawings refer to a length direction, a width direction, and athickness direction, respectively. Here, the thickness direction refersto a stacking direction in which dielectric layers are stacked.

A multilayer ceramic electronic component according to an exemplaryembodiment, particularly a multilayer ceramic capacitor, willhereinafter be described. However, the multilayer ceramic electroniccomponent according to the present disclosure is not limited thereto.

FIG. 1 is a perspective view illustrating a multilayer ceramicelectronic component according to an exemplary embodiment, FIG. 2 is across-sectional view taken along line A-A′ of FIG. 1, and FIG. 3 is anenlarged view of region S of FIG. 2.

Referring to FIGS. 1 through 3, a multilayer ceramic electroniccomponent 100 according to an exemplary embodiment may include a ceramicbody 110, and first and second external electrodes 131 and 132.

The ceramic body 110 may be formed of a hexahedron having end surfacesopposite each other in a length direction L, side surfaces opposite eachother in a width direction W, and side surfaces opposite each other in athickness direction T. The ceramic body 110 may be formed by stacking aplurality of dielectric layers 111 in the thickness direction T and thensintering the plurality of dielectric layers 111. A shape and adimension of the ceramic body 110 and the number (one or more) ofstacked dielectric layers 111 are not limited to those illustrated inthe present exemplary embodiment.

The plurality of dielectric layers 111 disposed in the ceramic body 110may be in a sintered state, and adjacent dielectric layers 111 may beintegrated with each other so that boundaries therebetween are notreadily apparent without using a scanning electron microscope (SEM).

The ceramic body 110 may have a form in which eight corners of thehexahedron are round. Therefore, durability and reliability of theceramic body 110 may be improved, and structural reliability of thefirst and second external electrodes 131 and 132 at the corners may beimproved.

The dielectric layers 111 may have a thickness arbitrarily changed inaccordance with a capacitance design of the multilayer ceramicelectronic component 100, and may include ceramic powders having a highdielectric constant, such as barium titanate (BaTiO₃)-based powders orstrontium titanate (SrTiO₃)-based powders. However, a material of thedielectric layer 111 according to the present disclosure is not limitedthereto. In addition, various ceramic additives, organic solvents,plasticizers, binders, dispersants, and the like, may be added to theceramic powders according to an object of the present disclosure.

An average particle size of the ceramic powders used to form thedielectric layer 111 is not particularly limited, and may be controlledin order to accomplish an object of the present disclosure. For example,the average particle size of the ceramic powders used to form thedielectric layer 111 may be controlled to be 400 nm or less. Therefore,the multilayer ceramic electronic component 100 according to anexemplary embodiment in the present disclosure may be used as acomponent that can be miniaturized and have a high capacitance, such asan information technology (IT) component.

For example, the dielectric layers 111 may be formed by applying andthen drying slurry including powders such as barium titanate (BaTiO₃)powders, or the like, to carrier films to prepare a plurality of ceramicsheets. The ceramic sheets may be formed by mixing ceramic powders, abinder, and a solvent with one another to prepare slurry andmanufacturing the slurry in a sheet shape having a thickness of severalmicrometers by a doctor blade method, but are not limited thereto.

First and second internal electrodes 121 and 122 may include at leastone first internal electrode 121 and at least one second internalelectrode 122 having different polarities, and may be formed atpredetermined thicknesses with each of the plurality of dielectriclayers 111 stacked in the thickness direction T of the ceramic body 110interposed therebetween.

The first internal electrodes 121 and the second internal electrodes 122may be formed to be respectively exposed to one end surface and theother end surface of the ceramic body 110 in the length direction L ofthe ceramic body 110 in the stack direction of the dielectric layers 111by printing a conductive paste including a conductive metal, and may beelectrically insulated from each other by each of the dielectric layers111 disposed therebetween. The first internal electrodes 121 and thesecond internal electrodes 122 may be alternately stacked with thedielectric layers 111 therebetween in the ceramic body 110.

That is, the first and second internal electrodes 121 and 122 may beelectrically connected to the first and second external electrodes 131and 132, respectively, formed on opposite end surfaces of the ceramicbody 110 in the length direction L of the ceramic body 110 throughportions alternately exposed to the opposite end surfaces of the ceramicbody 110 in the length direction of the ceramic body 110.

For example, the first and second internal electrodes 121 and 122 mayinclude metal powders having an average particle size of 0.1 to 0.2 μm,and may be formed of a conductive paste for an internal electrodeincluding 40 to 50 wt % of conductive metal powders, but are not limitedthereto.

The conductive paste for an internal electrode may be applied to theceramic sheets by a printing method, or the like, to form internalelectrode patterns. A method of printing the conductive paste may be ascreen printing method, a gravure printing method, or the like, but isnot limited thereto. Two hundred or three hundred ceramic sheets onwhich the internal electrode patterns are printed may be stacked,pressed, and sintered to manufacture the ceramic body 110.

Therefore, when voltages are applied to the first and second externalelectrodes 131 and 132, electric charges may be accumulated between thefirst and second internal electrodes 121 and 122 facing each other. Inthis case, a capacitance of the multilayer ceramic capacitor 100 may bein proportion to an area of a region in which the first and secondinternal electrodes 121 and 122 overlap each other.

That is, when the area of the region in which the first and secondinternal electrodes 121 and 122 overlap each other is significantlyincreased, a capacitance may be significantly increased even in acapacitor having the same size.

Widths of the first and second internal electrodes 121 and 122 may bedetermined depending on the purpose, and may be, for example, 0.4 μm orless. Therefore, the multilayer ceramic electronic component 100according to an exemplary embodiment in the present disclosure may beused as a component that can be miniaturized and have a highcapacitance, such as an information technology (IT) component.

Since the thickness of the dielectric layer 111 corresponds to aninterval between the first and second internal electrodes 121 and 122,the smaller the thickness of the dielectric layer 111, the greater thecapacitance of the multilayer ceramic electronic component 100.

Meanwhile, the conductive metal included in the conductive paste formingthe first and second internal electrodes 121 and 122 may be nickel (Ni),copper (Cu), palladium (Pd), silver (Ag), lead (Pb), or platinum (Pt),or alloys thereof. However, the conductive metal according to thepresent disclosure is not limited thereto.

The first and second external electrodes 131 and 132 may be disposed onouter surfaces of the ceramic body 110 to be connected to the first andsecond internal electrodes 121 and 122, respectively. The first externalelectrode 131 may be configured to electrically connect the firstinternal electrodes 121 and a board to each other, and the secondexternal electrode 132 may be configured to electrically connect thesecond internal electrodes 122 and the board to each other.

The first and second external electrodes 131 and 132 may include,respectively, first and second plating layers 131 c and 132 c for thepurpose of at least a portion of structural reliability, easiness inmounting the multilayer ceramic electronic component on the board,durability against external impact, heat resistance, and an equivalentseries resistance (ESR).

For example, the first and second plating layers 131 c and 132 c may beformed by sputtering or electric deposition, but are not limitedthereto.

For example, the first and second plating layers 131 c and 132 c maymainly contain nickel, but are not limited thereto, and may also beimplemented by copper (Cu), palladium (Pd), platinum (Pt), gold (Au),silver (Ag), or lead (Pb), or alloys thereof.

The first and second external electrodes 131 and 132 may furtherinclude, respectively, first and second base electrode layers 131 a and132 a disposed between the first and second internal electrodes 121 and122 and the first and second plating layers 131 c and 132 c,respectively, and at least partially in contact with the outer surfacesof the ceramic body 110.

The first and second base electrode layers 131 a and 132 a may berelatively easily coupled to the first and second internal electrodes121 and 122, respectively, as compared to the first and second platinglayers 131 c and 132 c, and may thus decrease contact resistancesagainst the first and second internal electrodes 121 and 122.

The first and second base electrode layers 131 a and 132 a may bedisposed in inner regions relative to the first and second platinglayers 131 c and 132 c in the first and second external electrodes 131and 132, respectively.

For example, the first and second base electrode layers 131 a and 132 amay be covered (e.g., fully covered) by the first and second platinglayers 131 c and 132 c and first and second conductive resin layers 131b and 132 b, respectively, so as not to be exposed externally of themultilayer ceramic electronic component 100.

For example, the first and second base electrode layers 131 a and 132 amay be formed by a method of dipping the ceramic body 110 in a pasteincluding a metal component or a method of printing a conductive pasteincluding a conductive metal on at least one surface of the ceramic body110 in the thickness direction T, and may also be formed by a sheettransfer method or a pad transfer method.

For example, the first and second base electrode layers 131 a and 132 amay be formed of copper (Cu), nickel (Ni), palladium (Pd), platinum(Pt), gold (Au), silver (Ag), or lead (Pb), or alloys thereof.

The first and second external electrodes 131 and 132 may furtherinclude, respectively, the first and second conductive resin layers 131b and 132 b disposed between the first and second base electrode layers131 a and 132 a and the first and second plating layers 131 c and 132 c,respectively.

Since the first and second conductive resin layers 131 b and 132 b haverelatively high flexibility as compared to the first and second platinglayers 131 c and 132 c, the first and second conductive resin layers 131b and 132 b may protect the multilayer ceramic electronic component 100from external physical impact or warpage impact of the multilayerceramic electronic component 100, and may absorb stress applied to theexternal electrodes at the time of mounting the multilayer ceramicelectronic component on the board or tensile stress to prevent a crackfrom being generated in the external electrodes.

For example, the first and second conductive resin layers 131 b and 132b may have high flexibility and high conductivity by having a structurein which conductive particles such as copper (Cu), nickel (Ni),palladium (Pd), platinum (Pt), gold (Au), silver (Ag), or lead (Pb), arecontained in a glass or a resin having high conductivity, such as anepoxy resin.

The first and second external electrodes 131 and 132 may furtherinclude, respectively, first and second tin plating layers 131 d and 132d disposed on outer surfaces of the first and second plating layers 131c and 132 c, respectively. The first and second tin plating layers 131 dand 132 d may further improve at least a portion of the structuralreliability, the easiness in mounting the multilayer ceramic electroniccomponent on the board, the durability against the external impact, theheat resistance, and the ESR.

FIG. 4 is a perspective view illustrating corners of the multilayerceramic electronic component according to an exemplary embodiment.

Referring to FIG. 4, the ceramic body 110 may include eight cornersincluding corners P1, P1-2, P1-3, and P1-4.

The first and second plating layers 131 c and 132 c may be disposed tocover the eight corners including corners P1, P1-2, P1-3, and P1-4 ofthe ceramic body 110.

Each of the first and second plating layers 131 c and 132 c may have athickness deviation.

For example, each of the first and second plating layers 131 c and 132 cmay have the greatest thickness at the center of a [width×thickness]surface, and may have the smallest thickness at points thereofcorresponding to the eight corners including corners P1, P1-2, P1-3, andP1-4.

Therefore, when an average thickness of each of the first and secondplating layers 131 c and 132 c is gradually decreased, holes may beformed or occur at the points of the first and second plating layers 131c and 132 c corresponding to the eight corners including corners P1,P1-2, P1-3, and P1-4. For example, holes may occur at points adjacentto, aligned with, or overlapping with the eight corners includingcorners P1, P1-2, P1-3, and P1-4. For instance, holes in close proximityto the eight corners including corners P1, P1-2, P1-3, and P1-4 mayoccur, such as holes disposed at a distance from a respective cornerthat is less than 10%, less than 5%, or less than 2% of a length of aside of the body of the multilayer component. The holes may overlap withor include the corners, such that corners are exposed through the holes.

The smaller the average thickness of each of the first and secondplating layers 131 c and 132 c, the greater the likely size of each ofthe holes.

As the average thickness of each of the first and second plating layers131 c and 132 c become small, the first and second plating layers 131 cand 132 c may improve reliability and warpage endurance of themultilayer ceramic electronic component against a cost of the multilayerceramic electronic component.

The holes formed as the thickness of each of the first and secondplating layers 131 c and 132 c becomes small may serve as an externalmoisture permeation path to decrease moistureproof reliability of themultilayer ceramic electronic component and decrease mountingreliability of the multilayer ceramic electronic component.

Therefore, when the thickness of each of the first and second platinglayers 131 c and 132 is optimized, the first and second plating layers131 c and 132 c may not only secure the reliability and the warpageendurance of the multilayer ceramic electronic component against thecost of the multilayer ceramic electronic component, but may also securethe moistureproof reliability and the mounting reliability.

Since each of the first and second plating layers 131 c and 132 c mayhave a thickness deviation at the points thereof corresponding to theeight corners including corners P1, P1-2, P1-3, and P1-4, when thethickness of each of the first and second plating layers 131 c and 132 cis controlled so that holes are formed at only points of each of thefirst and second plating layers 131 c and 132 c corresponding to (e.g.,aligned with, or overlapping with) some of the eight corners includingcorners P1, P1-2, P1-3, and P1-4 at the time of forming the first andsecond plating layers 131 c and 132 c, the thickness of each of thefirst and second plating layers 131 c and 132 c may be optimized.

Table 1 represents mounting reliability and moistureproof reliabilitydepending on a frequency of hole forming at one of the eight cornersincluding corners P1, P1-2, P1-3, and P1-4.

TABLE 1 Mounting Hole Forming Defect Moistureproof Reliability FrequencyFrequency Defect Frequency Number of Times of Measurement Design No. 10400 400 1 10 87 112 2 9 64 88 3 9 66 93 4 7 33 48 5 6 9 51 6 6 3 5 7 5 10 8 3 0 0 9 2 0 0 10 0 0 0

Referring to Table 1, when a hole forming frequency is less than 50%, amounting defect and a moistureproof reliability defect may be prevented.

That is, when the thickness of each of the first and second platinglayers 131 c and 132 c is controlled so that each of the first andsecond plating layers 131 c and 132 c has one or more to three or lessholes positioned at the points thereof corresponding to the eightcorners including corners P1, P1-2, P1-3, and P1-4, the mounting defectand the moistureproof reliability defect may be prevented.

For example, a thickness of each of the first and second externalelectrodes 131 and 132 at the center of the [width×thickness] surfacemay be controlled to be 101 μm or less.

Therefore, in the multilayer ceramic electronic component according toan exemplary embodiment, the reliability and the warpage endurance ofthe multilayer ceramic electronic component against the cost of themultilayer ceramic electronic component as well as the moistureproofreliability and the mounting reliability may be secured.

For example, a thickness of each of the first and second plating layers131 c and 132 c at the center of the [width×thickness] surface may becontrolled to be 3 μm or more to 5 μm or less.

Therefore, in the multilayer ceramic electronic component according toan exemplary embodiment, the reliability and the warpage endurance ofthe multilayer ceramic electronic component against the cost of themultilayer ceramic electronic component as well as the moistureproofreliability and the mounting reliability may be secured.

The first and second conductive resin layers 131 b and 132 b may beexposed through and extend across the holes in the first and secondplating layers 131 c and 132 c, respectively. Therefore, durability ofthe multilayer ceramic electronic component according to an exemplaryembodiment against external physical impact or warpage impact of themultilayer ceramic electronic component 100 may not be substantiallydeteriorated.

Meanwhile, in the multilayer ceramic electronic component according toan exemplary embodiment, the moistureproof reliability and the mountingreliability as well as the reliability and the warpage endurance of themultilayer ceramic electronic component against the cost of themultilayer ceramic electronic component may be secured by optimizing athickness of each of the first and second base electrode layers 131 aand 132 a illustrated in FIGS. 1 through 3 instead of the first andsecond plating layers 131 c and 132 c.

The reason is that each of the first and second base electrode layers131 a and 132 a may also have a thickness deviation due to fluidity andviscosity in a process of being formed, similar to the thicknessdeviation of each of the first and second plating layers 131 c and 132c.

That is, the first and second base electrode layers 131 a and 132 a mayhave one or more to three or less holes positioned at one or more tothree or less of eight points of the first and second base electrodelayers 131 a and 132 a closest to the eight corners including cornersP1, P1-2, P1-3, and P1-4 of the ceramic body 110. For example, holes mayoccur at points adjacent to, aligned with, or overlapping with the eightcorners including corners P1, P1-2, P1-3, and P1-4. For instance, holesin close proximity to the eight corners including corners P1, P1-2,P1-3, and P1-4 may occur, such as holes disposed at a distance from arespective corner that is less than 10%, less than 5%, or less than 2%of a length of a side of the body of the multilayer component. The holesmay overlap with or include the corners, such that corners are exposedthrough the holes

Meanwhile, in the multilayer ceramic electronic component according toan exemplary embodiment, the thickness of each of the first and secondexternal electrodes 131 and 132 may further be decreased and themoistureproof reliability and the mounting reliability may be secured byoptimizing both of the thickness of the first and second plating layers131 c and 132 c and the thickness of each of the first and second baseelectrode layers 131 a and 132 a.

That is, some of the eight corners including corners P1, P1-2, P1-3, andP1-4 of the ceramic body 110 may be exposed through holes of the firstand second external electrodes 131 and 132.

Here, the first and second tin plating layers 131 d and 132 d may coverthe holes through which the ceramic body 110 is exposed. Depending on adesign, the first and second conductive resin layers 131 b and 132 b mayadditionally cover the holes through which the ceramic body 110 isexposed.

FIG. 5 is a perspective view illustrating a form in which the multilayerceramic electronic component according to an exemplary embodiment ismounted.

Referring to FIG. 5, the multilayer ceramic electronic component 100according to an exemplary embodiment may include first and secondsolders 230 connected, respectively, to the first and second externalelectrodes 131 and 132 to be electrically connected to a board 210.

For example, the board 210 may include first and second electrode pads221 and 222, and the first and second solders 230 may be disposed on thefirst and second electrode pads 221 and 222, respectively.

When corners of the ceramic body 110 are round, the first and secondsolders 230 may be filled in surplus spaces depending on the roundcorners of the ceramic body 110.

The first and second solders 230 may be more closely coupled to thefirst and second external electrodes 131 and 132, respectively, in areflow process, and the multilayer ceramic electronic component 100according to an exemplary embodiment may not only have the first andsecond external electrodes 131 and 132 that are relatively thin, but mayalso have the mounting reliability, such that a disconnection of thefirst and second solders 230 in the reflow process may be prevented.

FIG. 6A shows images, captured by a scanning electron microscope (SEM),of a multilayer ceramic electronic component that has holes disposed atcorners and extending through an external electrode. In contrast, FIG.6B shows images, captured by an SEM, of a multilayer ceramic electroniccomponent that does not have holes extending through all layers of anexternal electrode at corners thereof.

As set forth above, in the multilayer ceramic electronic componentaccording to an exemplary embodiment, the thickness of the externalelectrode may be decreased and deterioration of moistureproofreliability and a mounting defective rate of the external electrode maybe substantially suppressed, by optimizing the number of holes of theplating layer and/or the base electrode layer.

While exemplary embodiments have been shown and described above, it willbe apparent to those skilled in the art that modifications andvariations could be made without departing from the scope of the presentinvention as defined by the appended claims.

1. A multilayer ceramic electronic component comprising: a ceramic bodyincluding dielectric layers and first and second internal electrodesalternately stacked in a thickness direction and respectively exposed toopposing end surfaces of the ceramic body with each of the dielectriclayers interposed therebetween; and first and second external electrodesdisposed on outer surfaces of the ceramic body to be connected to thefirst and second internal electrodes, respectively, and disposed tocover at least five of eight corners of the ceramic body, wherein thefirst and second external electrodes include, respectively, first andsecond base electrode layers at least partially in contact with theouter surfaces of the ceramic body and first and second plating layersdisposed to cover the first and second base electrode layers,respectively, and the first and second base electrode layers cover atleast one corner of the ceramic body, and have one or more to three orless holes positioned closer to one of the eight corners of the ceramicbody than to the center of the ceramic body in the thickness directionand to the center of the ceramic body in the width direction.
 2. Themultilayer ceramic electronic component of claim 1, wherein each of thefirst and second internal electrodes extends in a plane extending inwidth and length directions, and a thickness of each of the first andsecond external electrodes at a center of a [width×thickness] surface is10 μm or less.
 3. The multilayer ceramic electronic component of claim2, wherein the first and second external electrodes further include,respectively, first and second conductive resin layers disposed betweenthe first and second base electrode layers and the first and secondplating layers, respectively, and at least one of the first and secondconductive resin layers covers the holes of the first and second baseelectrode layers, respectively.
 4. The multilayer ceramic electroniccomponent of claim 2, wherein at least one of the first and secondplating layers covers the holes of the first and second base electrodelayers, respectively.
 5. The multilayer ceramic electronic component ofclaim 2, wherein the first and second external electrodes furtherinclude, respectively, first and second tin plating layers disposed onouter surfaces of the first and second plating layers, respectively, andeach of the first and second plating layers contains nickel.
 6. Themultilayer ceramic electronic component of claim 2, wherein an averagethickness of each dielectric layer disposed between adjacent first andsecond internal electrodes is 0.4 μm or less, and an average thicknessof each of the first and second internal electrodes is 0.4 μm or less.7. A multilayer ceramic electronic component comprising: a ceramic bodyincluding alternately stacked first and second internal electrodes withdielectric layers therebetween; and first and second external electrodesdisposed on respective opposing end surface of the ceramic body throughwhich the first and second internal electrodes are respectively exposed,and extending on four side surfaces of the ceramic body adjacent to theopposing end surfaces, wherein the first and second external electrodesare disposed on at least five of eight corners of the ceramic body, eachof the first and second external electrodes includes a base electrodelayer in contact with the respective end surface and the four sidesurfaces of the ceramic body, and a plating layer covering the baseelectrode layer, and at least one of the base electrode layers and theplating layers of the first and second external electrodes covers atleast one corner of the ceramic body, and includes one or more and threeor less holes extending therethrough, wherein the holes are positionedcloser to one of the eight corners of the ceramic body than to thecenter of the ceramic body in the thickness direction and to the centerof the ceramic body in the width direction.
 8. The multilayer ceramicelectronic component of claim 7, wherein the one or more and three ofless holes are each disposed to include therein at least one corner ofthe ceramic body.
 9. The multilayer ceramic electronic component ofclaim 7, wherein at least one of the base electrode layers and theplating layers extends across the hole disposed in the other of the baseelectrode layers and the plating layers.
 10. The multilayer ceramicelectronic component of claim 7, wherein the at least one of the baseelectrode layers and the plating layers having the one or more and threeor less holes extending therethrough extends over at least onerespective edge between adjacent outer surfaces of the ceramic body. 11.A multilayer ceramic electronic component comprising: a ceramic bodyincluding dielectric layers and first and second internal electrodesalternately stacked in a thickness direction and respectively exposed toopposing end surfaces of the ceramic body with each of the dielectriclayers interposed therebetween; and first and second external electrodesdisposed on outer surfaces of the ceramic body to be connected to thefirst and second internal electrodes, respectively, and disposed tocover at least five of eight corners of the ceramic body, wherein thefirst and second external electrodes include, respectively, first andsecond base electrode layers at least partially in contact with theouter surfaces of the ceramic body and first and second plating layersdisposed to cover the first and second base electrode layers,respectively, and at least one of the first and second base electrodelayers extends over at least one respective edge between adjacent outersurfaces of the ceramic body and has one or more to three or less holespositioned closer to one of the eight corners of the ceramic body thanto the center of the ceramic body in the thickness direction and to thecenter of the ceramic body in the width direction.
 12. The multilayerceramic electronic component of claim 11, wherein each of the first andsecond internal electrodes extends in a plane extending in width andlength directions, and a thickness of each of the first and secondexternal electrodes at a center of a [width×thickness] surface is 10 μmor less.
 13. The multilayer ceramic electronic component of claim 11,wherein the first and second external electrodes further include,respectively, first and second conductive resin layers disposed betweenthe first and second base electrode layers and the first and secondplating layers, respectively, and at least one of the first and secondconductive resin layers covers the holes of the at least one of thefirst and second base electrode layers.
 14. The multilayer ceramicelectronic component of claim 11, wherein at least one of the first andsecond plating layers covers the holes of the at least one of the firstand second base electrode layers.
 15. The multilayer ceramic electroniccomponent of claim 11, wherein the first and second external electrodesfurther include, respectively, first and second tin plating layersdisposed on outer surfaces of the first and second plating layers,respectively, and each of the first and second plating layers containsnickel.
 16. The multilayer ceramic electronic component of claim 11,wherein an average thickness of each dielectric layer disposed betweenadjacent first and second internal electrodes is 0.4 μm or less, and anaverage thickness of each of the first and second internal electrodes is0.4 μm or less.